Bond University Scholarship applications close 6 September!

Bond University’s Scholarship Program encompasses a range of full-fee and part-fee tuition remission scholarships available to future leaders and provides them with access to an exceptional educational experience. Scholarships are awarded to the best and brightest all rounded students who have excelled academically, or in the areas of leadership, community and sport.

Applications close 6 September

For further information visit or download our Scholarship Brochure.

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